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 Products – Ceramic Application |
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We are proficient in the laser process, especially laser scribing and drilling and cutting for ceramic substrate,
We here explained more detail the capability for all of kind laser process what we have:
Laser Scribing:
1.
The minimum width of scribing: CO2 type Laser is in 50um, Green type laser is in 25um
2. Repeatable to hit at the same spot and the accuracy can be keep in +/- 5um, this process can be applied to thick ceramic substrate (the thickness high than 60mil) or other specially product.
3.
We are able to organized to completely reduplicated at the junction of two lines to reducing the yield loss when breaks stage.
4.
We are able to reduce the molten ashes and heat problem by specialize lighting source in the production.
5.
For example
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Ps.
We measured the average depth of 20 point continuous, tolerance +/-50um and Cpk >=1.5
We measured the average pitch of 10 point continuous, tolerance +/-12.7um and Cpk>=2.3 |
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| Drilling holes |
| 1. minimums diameter : |
pulsing 40um |
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drilling 250um |
| tolerance : |
pulsing 40um±5um |
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80um±10um |
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drilling 250um±25um |
| 2. 上下孔半徑誤差 5% of substrate thickness The difference in diameter between the front hole and the rear hole there is 10% of substrate thickness. |
3. 孔邊至孔邊最小距離the minimums space of holes:
pulsing≧1/2 thickness of substrate板厚
drilling≧2/3 thickness of substrate 板厚
tolerance ±5um |
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Cutting
1. Tolerances:±10um
2. Positioning accuracy:±5um |
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 CER |
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CER |
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Close point |
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Heat Sink for power parts |
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Thick Ceramic Process
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The hole of heat conduction |
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LED Substrate
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Hybrid IC |
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Chip Resistance Cutting
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A substrate to loading chip parts |
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Green shit drilling |
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Ceramic Substrate Cutting
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