精密陶瓷 |
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陶瓷基板之雷射製程能力說明與數據(進一步資料請洽鉅大光電)
Laser Scribing:
1. 最小線寬:CO2 LASER=50um (GREEN LASER=25um)
2. 可重覆打在同一spot, accuracy:±5um可做厚板加工(60mil以上),及特殊應用.
3. X,Y軸交錯點可設計成完全重疊,提昇折片良率與邊品質.
4. 特殊光源光型處理，降低熔渣產生量及熱影響.
5. 圖例
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Ps.Depth:測量方式連續20點之平均深度。深度公差±50um Cpk>=1.5
Spacing測量方式連續10點之平均間距。間距公差±12.7um cpk>=2.3 |
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| Drilling holes |
| 1. 最小孔徑: |
pulsing 40um |
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drilling 250um |
| 2. 孔直徑誤差: |
pulsing 40um±5um |
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80um±10um |
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drilling 250um±25um |
| 3. 上下孔半徑誤差 5% of substrate thickness |
| 4. 孔邊至孔邊最小距離 |
pulsing≧1/2板厚 |
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drilling≧2/3板厚 |
| 5. 孔至孔位置誤差±5um |
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Cutting
1. Tolerances:±10um
2. Positioning accuracy:±5um |
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 CER |
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CER |
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Close point |
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功率散熱元件
Heat Sink for power parts |
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厚板陶瓷加工
Thick Ceramic Process
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導熱孔
The hole of heat conduction |
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LED散熱基板
LED Substrate
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Hybrid IC |
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晶片電阻切割
Chip Resistance Cutting
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晶片元件載板
A substrate to loading chip parts |
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陶瓷生胚鑽孔
Green shit drilling |
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陶瓷基板切割
Ceramic Substrate Cutting
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